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General DRAM packaging formats
Common DRAM packages. From top to bottom: DIP, SIPP, SIMM (30-pin), SIMM (72-pin), DIMM (168-pin), DDR DIMM (184-pin).
EDO DRAM memory module
Dynamic random access memory is produced as integrated circuits (ICs) bonded and mounted into plastic packages with metal pins for connection to control signals and buses. Today, these DRAM packages are in turn often assembled into plug-in modules for easier handling. Some standard module types are:
DRAM chip (Integrated Circuit or IC)
Dual in-line Package (DIP)
DRAM (memory) modules
Single In-line Pin Package (SIPP)
Single In-line Memory Module (SIMM)
Dual In-line Memory Module (DIMM)
Rambus In-line Memory Module (RIMM), technically DIMMs but called RIMMs due to their proprietary slot.
Small outline DIMM (SO-DIMM), about half the size of regular DIMMs, are mostly used in notebooks, small footprint PCs (such as Mini-ITX motherboards), upgradable office printers and networking hardware like routers. Comes in versions with:
Small outline RIMM (SO-RIMM). Smaller version of the RIMM, used in laptops. Technically SO-DIMMs but called SO-RIMMs due to their proprietary slot.
Stacked vs. non-stacked RAM modules
Stacked RAM modules contain two or more RAM chips stacked on top of each other. This allows large modules (like 512 MB or 1 GB SO-DIMM) to be manufactured using cheaper low density wafers. Stacked chip modules draw more power.
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Common DRAM packages. From top to bottom: DIP, SIPP, SIMM (30-pin), SIMM (72-pin), DIMM (168-pin), DDR DIMM (184-pin).
EDO DRAM memory module
Dynamic random access memory is produced as integrated circuits (ICs) bonded and mounted into plastic packages with metal pins for connection to control signals and buses. Today, these DRAM packages are in turn often assembled into plug-in modules for easier handling. Some standard module types are:
DRAM chip (Integrated Circuit or IC)
Dual in-line Package (DIP)
DRAM (memory) modules
Single In-line Pin Package (SIPP)
Single In-line Memory Module (SIMM)
Dual In-line Memory Module (DIMM)
Rambus In-line Memory Module (RIMM), technically DIMMs but called RIMMs due to their proprietary slot.
Small outline DIMM (SO-DIMM), about half the size of regular DIMMs, are mostly used in notebooks, small footprint PCs (such as Mini-ITX motherboards), upgradable office printers and networking hardware like routers. Comes in versions with:
Small outline RIMM (SO-RIMM). Smaller version of the RIMM, used in laptops. Technically SO-DIMMs but called SO-RIMMs due to their proprietary slot.
Stacked vs. non-stacked RAM modules
Stacked RAM modules contain two or more RAM chips stacked on top of each other. This allows large modules (like 512 MB or 1 GB SO-DIMM) to be manufactured using cheaper low density wafers. Stacked chip modules draw more power.
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synthetic stone
